Best Paper Prize in the IEEE International Workshop on Antenna Technology
 
 
 
The paper "Antenna-in-package in LTCC for 60-GHz radios" co-authored by Y. P. Zhang and M. Sun of Nanyang Technological University, K. M. Chua and L. L. Wai of Singapore Institute of Manufacturing Technology, and D. X. Liu and B. Gaucher of IBM T. J. Watson Center won the Best Paper Prize in the IEEE International Workshop on Antenna Technology held from 20-23 March 2007 in Cambridge University, UK.
An antenna, a key component of a radio transceiver, is immune to miniaturization or digitization.  Currently, it appears impossible to integrate it into a single chip radio transceiver for efficient radiation.  Consequently, it is left external to the single chip radio transceiver and is usually realized as a small discrete antenna.   Antenna-in-Package (AiP) technology has emerged as the most elegant antenna solution technology for single chip radio transceivers. AiP technology combines an antenna (or antennas) with a single chip RF transceiver die into a standard surface mounted device. It symbolizes an innovative and important development in the miniaturization of wireless system in recent years.
AiP technology was originally developed for wireless local area network applications at 2.4 or 5.8 GHz by A/Prof. Y. P. Zhang's Group of Division of Circuits and Systems.  Recently, in addition to this award-winning AiP technology for 60-GHz radios, AiP technology for ultrawide-band (UWB) radios has also successfully been developed.
29/December/2007 18:16
 
 
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